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10546_12012003 Image LePage No More Nails Foamboard.jpg

LePage No More Nails Foamboard


Products in this Consumer Product Information Database (CPID) are classified based on their composition:
Substances: single chemicals
Preparations: products which contain chemicals that can be easily separated during normal use

Articles: products or product assemblies that do not contain chemicals that can be separated out from the product or assembly under normal or advertised use.



Indicates country where product is sold.

Brand Information
Date entered: March 12, 2011
LePage No More Nails Foamboard is a premium quality, high strength, gap-filling adhesive. It will bond most types of foamboard insulation to a variety of surfaces. Will not etch or burn foam and no venting is required. Recomended for bonding all types of foamboard insulation and ceiling tiles to wood, drywall, concrete, metal and fiberglass.

Purpose of product.

Foam Insulation Board Adhesive

Structure such as solid, liquid, aerosol etc.

Customer Service No: 800-624-7767
Manufacturer Information

Date when validity of Material Safety Data Sheet (MSDS) or Safety Data Sheet (SDS) was last verified.

Date verified: March 20, 2020
LePage-Henkel Canada Corporation

6685 Kennedy Road  Suite #1
Mississauga Ontario L5T 3A5, Canada

800-624-7767 ^
800-624-7767 (TOLL FREE)